说明
Cu Barrier Seed depostion配置
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEM 型号描述
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文件
无文件
LAM RESEARCH / NOVELLUS
INOVA
已验证
类别
Deposition
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
50644
晶圆尺寸：
12"/300mm
年份：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
LAM RESEARCH / NOVELLUS
INOVA
已验证
类别
Deposition
上次验证： 18 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
50644
晶圆尺寸：
12"/300mm
年份：
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Cu Barrier Seed depostion配置
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEM 型号描述
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文件
无文件