说明
Specially designed for advanced IC and discrete packages,AD8312 provides a high speed automatic epoxy die bonding solution for alround IC and discrete applications. The high speed bonding performance and ecellent accuracy of ±1 mil@ 3 σ and MS Windows@ operating system makes AD8312 a perfect fit for your IC and discrete assembly solution.配置
无配置OEM 型号描述
The newly developed ASM Die Bonder AD8312 offers a wide range of benefits with the sole target of producing highest speed and quality at lowest cost per die placement. Special handling and operating aspects of stacked and thin die are incorporated in the revolutionary machine concept. The extremely fast vision system and the ultra-light pick and place head with his innovative linear motor technology offer an incredible increase in performance, product quality and yield.文件
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ASM
AD8312
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79141
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Specially designed for advanced IC and discrete packages,AD8312 provides a high speed automatic epoxy die bonding solution for alround IC and discrete applications. The high speed bonding performance and ecellent accuracy of ±1 mil@ 3 σ and MS Windows@ operating system makes AD8312 a perfect fit for your IC and discrete assembly solution.配置
无配置OEM 型号描述
The newly developed ASM Die Bonder AD8312 offers a wide range of benefits with the sole target of producing highest speed and quality at lowest cost per die placement. Special handling and operating aspects of stacked and thin die are incorporated in the revolutionary machine concept. The extremely fast vision system and the ultra-light pick and place head with his innovative linear motor technology offer an incredible increase in performance, product quality and yield.文件
无文件