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ASM AD8312FC
    说明
    Die bonder
    配置
    无配置
    OEM 型号描述
    The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.
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    verified-listing-icon

    已验证

    类别
    Die Bonders / Sorters / Attachers

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    65365


    晶圆尺寸:

    未知


    年份:

    2015


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    ASM

    AD8312FC

    verified-listing-icon
    已验证
    类别
    Die Bonders / Sorters / Attachers
    上次验证: 60 多天前
    listing-photo-17b43be5ff3a4c16886605b01a1b7d4b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50884/17b43be5ff3a4c16886605b01a1b7d4b/27506a84d3474737bab1f11b32edad9c_9eb456ca99ff4fe78a4eb5fbc74a14091201a_mw.jpeg
    listing-photo-17b43be5ff3a4c16886605b01a1b7d4b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50884/17b43be5ff3a4c16886605b01a1b7d4b/35cc4b9efac54d9194977e011b0fe196_81dfadb70932416ca86299bffc6d61001201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    65365


    晶圆尺寸:

    未知


    年份:

    2015


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Die bonder
    配置
    无配置
    OEM 型号描述
    The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.
    文件

    无文件