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ASM AD838
  • ASM AD838
  • ASM AD838
说明
Solidifying machine and laminating machine. AD838 is an automatic high speed epoxy die bonder with up to 4"(101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.
配置
无配置
OEM 型号描述
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.
文件

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verified-listing-icon

已验证

类别
Die Bonders / Sorters / Attachers

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

79228


晶圆尺寸:

4"/100mm


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
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ASM

AD838

verified-listing-icon
已验证
类别
Die Bonders / Sorters / Attachers
上次验证: 60 多天前
listing-photo-ae70bfacc1a841b0aec45f5237959096-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/ae70bfacc1a841b0aec45f5237959096/145ef626a8ba4cf0bb06c58697b1e453_ad8382_mw.jpg
listing-photo-ae70bfacc1a841b0aec45f5237959096-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/ae70bfacc1a841b0aec45f5237959096/53a02f52034c4229abd668785f476488_ad8381_mw.jpg
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

79228


晶圆尺寸:

4"/100mm


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Solidifying machine and laminating machine. AD838 is an automatic high speed epoxy die bonder with up to 4"(101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.
配置
无配置
OEM 型号描述
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.
文件

无文件

类似上架物品
查看全部