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说明
无说明配置
无配置OEM 型号描述
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate文件
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ASM
IS868LA2
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
110297
晶圆尺寸：
未知
年份：
未知
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说明
无说明配置
无配置OEM 型号描述
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate文件
无文件