AD838P
概述
Automatic high precision epoxy die bonder High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.
活动的上架物品
1
服务
检验、保险、评估、物流
Automatic high precision epoxy die bonder High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.
1
检验、保险、评估、物流