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说明
ASM Twin832P DIE BOND配置
无配置OEM 型号描述
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.文件
无文件
ASM
TWIN832
类别
Die Bonders / Sorters / Attachers
上次验证： 23 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
123876
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ASM Twin832P DIE BOND配置
无配置OEM 型号描述
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.文件
无文件