说明
DIE BOND配置
无配置OEM 型号描述
The ESEC 2007 HS Plus is a die attacher manufactured by ESEC. Die attachers are used in the semiconductor industry to attach dies to substrates or lead frames.文件
无文件
BESI / ESEC
2007 HS plus
已验证
类别
Die Bonders / Sorters / Attachers
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
118081
晶圆尺寸：
未知
年份：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2007 HS plus
类别
Die Bonders / Sorters / Attachers
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
118081
晶圆尺寸：
未知
年份：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
DIE BOND配置
无配置OEM 型号描述
The ESEC 2007 HS Plus is a die attacher manufactured by ESEC. Die attachers are used in the semiconductor industry to attach dies to substrates or lead frames.文件
无文件