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BESI / ESEC 2007 SSI plus
    说明
    Soft Solder Die Bonder.
    配置
    无配置
    OEM 型号描述
    The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.
    文件

    无文件

    BESI / ESEC

    2007 SSI plus

    verified-listing-icon

    已验证

    类别
    Die Bonders / Sorters / Attachers

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    27460


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    BESI / ESEC 2007 SSI plus

    BESI / ESEC

    2007 SSI plus

    Die Bonders / Sorters / Attachers
    年份: 0状况: 二手
    上次验证60 多天前

    BESI / ESEC

    2007 SSI plus

    verified-listing-icon
    已验证
    类别
    Die Bonders / Sorters / Attachers
    上次验证: 60 多天前
    listing-photo-92b65e3ad8ce472094fdf33c8f9331b2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/92b65e3ad8ce472094fdf33c8f9331b2/41d68417ad3b47b69603e812e73d297e_89ce7694169b4d4193f15c0d0da27a3a45005c_f.jpeg
    listing-photo-92b65e3ad8ce472094fdf33c8f9331b2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/92b65e3ad8ce472094fdf33c8f9331b2/31ef88515013432eb3deb287527a59e7_6e80209a728248ddaa391dff0161e4c445005c_f.jpeg
    listing-photo-92b65e3ad8ce472094fdf33c8f9331b2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/92b65e3ad8ce472094fdf33c8f9331b2/82d8d05881aa477b8914eed167c07565_e96be70ce21e4d5ea4d6ffcbfef450ae45005c_f.jpeg
    listing-photo-92b65e3ad8ce472094fdf33c8f9331b2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/92b65e3ad8ce472094fdf33c8f9331b2/431b82197b6b4070b6a7abf8f3294274_4ff05612b51a4b388f82515b6446ca0545005c_f.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    27460


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Soft Solder Die Bonder.
    配置
    无配置
    OEM 型号描述
    The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.
    文件

    无文件

    类似上架物品
    查看全部
    BESI / ESEC 2007 SSI plus

    BESI / ESEC

    2007 SSI plus

    Die Bonders / Sorters / Attachers年份: 0状况: 二手上次验证:60 多天前
    BESI / ESEC 2007 SSI plus

    BESI / ESEC

    2007 SSI plus

    Die Bonders / Sorters / Attachers年份: 0状况: 零件工具上次验证:60 多天前