说明
Flip Chip Die Bonder配置
- 0 µm accuracy - Up to 12k UPH - 230 VOEM 型号描述
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance文件
无文件
类别
Die Bonders / Sorters / Attachers
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
152704
晶圆尺寸：
12"/300mm
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 FC hS
类别
Die Bonders / Sorters / Attachers
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
152704
晶圆尺寸：
12"/300mm
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Flip Chip Die Bonder配置
- 0 µm accuracy - Up to 12k UPH - 230 VOEM 型号描述
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance文件
无文件