说明
The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 um. Optionally, the accuracy can even be improved, down to 15 um. Minimal distances between pick and bond positions coupled with the stiff symmetrical bond head and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder Esec 2100 xPplus.配置
无配置OEM 型号描述
The Fastest 12" Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.文件
无文件
BESI / ESEC
2100 xP plus
已验证
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79188
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 xP plus
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79188
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 um. Optionally, the accuracy can even be improved, down to 15 um. Minimal distances between pick and bond positions coupled with the stiff symmetrical bond head and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder Esec 2100 xPplus.配置
无配置OEM 型号描述
The Fastest 12" Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.文件
无文件