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说明
无说明配置
Standard Machine (single module): Pickup Tool Changer module Ejector Tool system 12" Wafer Handling system Flat Belt transport system Substrate looking camera Upward looking camera Dispenser types: Time Pressure Fluxer system Flip Chip moduleOEM 型号描述
The 2200 apm+ is a die bonder from Datacon that is designed for advanced packaging with flip chip and die attach technologies. It can handle wafers of up to 300 mm and dies of up to 50 mm. The machine has a placement accuracy of 10µm@3s, making it suitable for handling the most demanding packages, including optoelectronic components. The 2200 apm+ is also capable of handling flip chip and die attach in one module, making it a versatile and flexible solution for advanced packaging. The machine is fully integrated into Datacon’s platform concept, allowing it to be combined with other line components such as stack loaders, Epoxy Writers, or the 2200 apm die bonder. This means that customers can tailor their production lines to their specific needs. The 2200 apm+ also has a range of accessories available, including wafer mapping, dispense units, gripper indexers, offline programming, and magazine handlers. Despite its advanced capabilities, the 2200 apm+ is operator-friendly and easy to use. Training times are short and reject rates are kept to a minimum. Users who have worked with the 2200 apm will find the transition to the 2200 apm+ seamless, as all software options are available on both machines.文件
无文件
PREFERRED
SELLER
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
31201
晶圆尺寸：
12"/300mm
年份：
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
BESI / DATACON
2200 APM+
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
31201
晶圆尺寸：
12"/300mm
年份：
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Standard Machine (single module): Pickup Tool Changer module Ejector Tool system 12" Wafer Handling system Flat Belt transport system Substrate looking camera Upward looking camera Dispenser types: Time Pressure Fluxer system Flip Chip moduleOEM 型号描述
The 2200 apm+ is a die bonder from Datacon that is designed for advanced packaging with flip chip and die attach technologies. It can handle wafers of up to 300 mm and dies of up to 50 mm. The machine has a placement accuracy of 10µm@3s, making it suitable for handling the most demanding packages, including optoelectronic components. The 2200 apm+ is also capable of handling flip chip and die attach in one module, making it a versatile and flexible solution for advanced packaging. The machine is fully integrated into Datacon’s platform concept, allowing it to be combined with other line components such as stack loaders, Epoxy Writers, or the 2200 apm die bonder. This means that customers can tailor their production lines to their specific needs. The 2200 apm+ also has a range of accessories available, including wafer mapping, dispense units, gripper indexers, offline programming, and magazine handlers. Despite its advanced capabilities, the 2200 apm+ is operator-friendly and easy to use. Training times are short and reject rates are kept to a minimum. Users who have worked with the 2200 apm will find the transition to the 2200 apm+ seamless, as all software options are available on both machines.文件
无文件