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BESI / DATACON 2200 APM
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.
    文件

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    BESI / DATACON

    2200 APM

    verified-listing-icon

    已验证

    类别
    Die Bonders / Sorters / Attachers

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    90192


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    BESI / DATACON 2200 APM

    BESI / DATACON

    2200 APM

    Die Bonders / Sorters / Attachers
    年份: 0状况: 二手
    上次验证60 多天前

    BESI / DATACON

    2200 APM

    verified-listing-icon
    已验证
    类别
    Die Bonders / Sorters / Attachers
    上次验证: 60 多天前
    listing-photo-d432f6d6d5bd4211a2fa954b8e6a233c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    90192


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.
    文件

    无文件

    类似上架物品
    查看全部
    BESI / DATACON 2200 APM

    BESI / DATACON

    2200 APM

    Die Bonders / Sorters / Attachers年份: 0状况: 二手上次验证:60 多天前
    BESI / DATACON 2200 APM

    BESI / DATACON

    2200 APM

    Die Bonders / Sorters / Attachers年份: 2005状况: 二手上次验证:60 多天前
    BESI / DATACON 2200 APM

    BESI / DATACON

    2200 APM

    Die Bonders / Sorters / Attachers年份: 2004状况: 二手上次验证:60 多天前