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BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
  • BESI / DATACON 2200 EVO plus
说明
Automatic Die Bonder Newer Used in Prodcution Die Attach, Flip Chip & Multi-Chip Capability Upgraded Camera Upgraded Image Processing Unit Large Format Heated Stage Thermal Compensation Open Platform Architecture
配置
无配置
OEM 型号描述
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.
文件

无文件

类别
Die Bonders / Sorters / Attachers

上次验证: 12 天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

129666


晶圆尺寸:

未知


年份:

2022


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

BESI / DATACON

2200 EVO plus

verified-listing-icon
已验证
类别
Die Bonders / Sorters / Attachers
上次验证: 12 天前
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物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

129666


晶圆尺寸:

未知


年份:

2022


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Automatic Die Bonder Newer Used in Prodcution Die Attach, Flip Chip & Multi-Chip Capability Upgraded Camera Upgraded Image Processing Unit Large Format Heated Stage Thermal Compensation Open Platform Architecture
配置
无配置
OEM 型号描述
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.
文件

无文件