FINETECH INC

FINEPLACER Pico 2

Micro assembly system with placement accuracy 3 um, ideal for component sizes ranging from 0.05 mm × 0.0. nm to 100 mm x 100 mm. Various process modules available to upgrade the machine for supporting a multitude of bonding technologies: 

- Thermo-Compression
- Thermosonic
- Ultrasonic 
- Soldering (AuSn, C4, Indium) 
- Adhesive Technologies
- Curing (UV, Thermal) 
- Mechanical Assembly



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FINEPLACER Pico 2

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FINETECH INC

FINEPLACER Pico 2

FINETECH INC

FINEPLACER Pico 2

FINETECH INC

FINEPLACER Pico 2

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