说明

Micro assembly system with placement accuracy 3 um, ideal for component sizes ranging from 0.05 mm × 0.0. nm to 100 mm x 100 mm. Various process modules available to upgrade the machine for supporting a multitude of bonding technologies: - Thermo-Compression - Thermosonic - Ultrasonic - Soldering (AuSn, C4, Indium) - Adhesive Technologies - Curing (UV, Thermal) - Mechanical Assembly

配置

Optical Alignment System: • High-resolution camera system • Zoom: manual • Field of view: max 16.5 mm x 12.4 mm / min 1.4 mm x 1 mm • Max. resolution: 2.4 um • Optical overlay of substrate and chip image • LED illumination (diffuse / coaxial) separately controlled for component and substrate • Target Finder for quickly and easily finding of the target position in the optical centre Automatic Bonding Force Module • Software-controlled bond force (constant values, dynamic force ramps) • Force range: 0.2 N up to 40 N • Tolerance 1: 0.1 N for forces up to 10 N • Tolerance 2: 1% of the set value for forces above 10 N Positioning table • Air-bearing, manual movement in all directions • Micrometer screws for fine positioning in X, Y & Z • Working area max.: 350mm x 155 mm • Rotatable positioning table (=2°) | • Suitable for various Substrate Heating Modules or substrate support plates and wafer chucks (heated or unheated) and presentations Placement Arm • For placement of components • Support of placement tools (unheated, heated) • Integrated, switchable vacuum supply • Support of optional modules, such as Chip Heating Module or UV Module • Integrated feed of additional media. e.g. process gas • Tool adjustment in Y: 50mm • Tool adjustment X: 43mm Integrated Process Management (IPM Command), providing synchronized control of all process modules and their parameters Prepared for controlling different Chip and Sbstrate Heating Modules, max. temperature 450°C, supportir mps up to 100 K/s (heating and cooling • Bonding force control (closed loop steady values / force ramps) • Control of process gas (time, flow, concentration) • Object surface optimized illumination control (diffuse and coaxial separately controlled) • Vacuum control • Control of additional modules, e. g. Dispenser Module, Ultrasonic Module • Protocol and documentation function (process data logging, photo) • Touch option for easy handling Machine-PC and touch monitor, designed for use when wearing gloves Dimensions and connection data for the standard version as described above: • Dimensions • Footprint (w x d): 140 cm x 85 cm • Total height: 71 cm • Weight • Base system, excl. system table: 110 kg • Electrical connection • Mains voltage: 220 V ...240 V • Frequency: 50 Hz / 60 HZ • Power consumption base system: 1,1 W • Compressed air • Nominal pressure: 5.5 bar to 7 bar • Max. flow: 100 l/min (base machine) • Max. solid particle size: 40 um • Humidity: max. pressure dew point: +3°C (class 4, DIN ISO 8573-1)