说明
Die Bond配置
无配置OEM 型号描述
The CM-700MX is a mounter for 300-mm wafers used in the assembly of the advanced packages required for high-speed DRAM (dynamic random access memory). It incorporates a precise positioning technique and lamination technique and achieves high productivity.文件
无文件
HITACHI
CM-700MX
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79455
晶圆尺寸：
未知
年份：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Die Bond配置
无配置OEM 型号描述
The CM-700MX is a mounter for 300-mm wafers used in the assembly of the advanced packages required for high-speed DRAM (dynamic random access memory). It incorporates a precise positioning technique and lamination technique and achieves high productivity.文件
无文件