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INFOTECH AUTOMATION IC-1600
    说明
    Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1700 Accessories Completeness - Main machine +IUPC loading and unloading
    配置
    Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)
    OEM 型号描述
    Die Bonder
    文件

    无文件

    INFOTECH AUTOMATION

    IC-1600

    verified-listing-icon

    已验证

    类别
    Die Bonders / Sorters / Attachers

    上次验证： 昨天

    物品主要详细信息
    状况：

    Used

    运行状况:

    未知

    产品编号：

    154508

    晶圆尺寸：

    未知

    年份：

    2022

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers
    年份： 2022状况： 二手
    上次验证昨天
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers
    年份： 2022状况： 二手
    上次验证昨天

    INFOTECH AUTOMATION

    IC-1600

    verified-listing-icon
    已验证
    类别
    Die Bonders / Sorters / Attachers
    上次验证： 昨天
    listing-photo-a39da77b647a47aeb12d5261b65a5a39-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/93230/a39da77b647a47aeb12d5261b65a5a39/54f0e0b77273427f97087bfaeeacce1e_1_mw.png
    listing-photo-a39da77b647a47aeb12d5261b65a5a39-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/93230/a39da77b647a47aeb12d5261b65a5a39/1cab551eace24747bae2e0d23a0f94db_2_mw.png
    物品主要详细信息
    状况：

    Used

    运行状况:

    未知

    产品编号：

    154508

    晶圆尺寸：

    未知

    年份：

    2022

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1700 Accessories Completeness - Main machine +IUPC loading and unloading
    配置
    Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)
    OEM 型号描述
    Die Bonder
    文件

    无文件

    类似上架物品
    查看全部
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers年份： 2022状况： 二手上次验证：昨天
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers年份： 2022状况： 二手上次验证：昨天