Kulicke & Soffa is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

KULICKE & SOFFA (K&S)

6496

Semiautomatic Flip Chip Die Bonder
±1.2 Mil @ 3 Sigma Placement Accuracy

50 to 3000 grams Bond Force Range

10sq. mil – 1000sq.mil Die Size Range

19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution

0.2 mrad/motor pulse Theta Rotation

Semiautomatic Epoxy Die Bonder
Waffle Pack Die Presentation 

±1.2 Mil @ 3 Sigma Placement Accuracy 

DSP-Based Pattern Recognition System

2ea Down-Looking CCD Video Cameras

Pneumatic Epoxy Dispenser

Semi-Automatic Epoxy Die Bonder, 2ea Available

6496

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KULICKE & SOFFA (K&S)

6496

KULICKE & SOFFA (K&S)

6496

KULICKE & SOFFA (K&S)

6496

KULICKE & SOFFA (K&S)

6496

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