说明
Fully functional, in production clean room配置
6, 8 and 12in wafer mounted on 17 in frameOEM 型号描述
Mi20 is a full specification platform designed for wafer to reel process in WLCSP. Below are the key features of Mi20: • Provides throughput up to 20,000 UPH • Handles 12" wafer or below • Ability to handle die size of 0.3 x 0.3 mm or larger文件
MI EQUIPMENT
MI20
已验证
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
106566
晶圆尺寸：
6"/150mm, 8"/200mm, 12"/300mm
年份：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MI EQUIPMENT
MI20
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
106566
晶圆尺寸：
6"/150mm, 8"/200mm, 12"/300mm
年份：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available