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说明
Automatic placement machine Details attached配置
无配置OEM 型号描述
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.文件
无文件
NEWPORT
MRSI 605
类别
Die Bonders / Sorters / Attachers
上次验证： 12 天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
111925
晶圆尺寸：
未知
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Automatic placement machine Details attached配置
无配置OEM 型号描述
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.文件
无文件