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PANASONIC MD-P200
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    文件

    PANASONIC

    MD-P200

    verified-listing-icon

    已验证

    类别
    Die Bonders / Sorters / Attachers

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    75480


    晶圆尺寸:

    未知


    年份:

    2021


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers
    年份: 2021状况: 二手
    上次验证60 多天前

    PANASONIC

    MD-P200

    verified-listing-icon
    已验证
    类别
    Die Bonders / Sorters / Attachers
    上次验证: 60 多天前
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/b3ade7ce335b46d8a5f2b949152cb4f6_21e14ccb689d4506a1aa53a457aa2f2645005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/60f73edf223f4cbe83e3602e6ad56957_fc079d33c9714131a32ab4afad3fe20445005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/08750c8ba1ce487d89e1bf6375fa08b0_d4005bb0777d4bf49187b6009f2b3eb345005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/c2be4d59889049148b87eee0cb3e9f9f_92c6a88e39454ba4adf4bd94192a39fb45005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/bfa0bad88706443eb692ae635fcd3ba2_82c03bb140d84c708f3a92e4b842a94945005c_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    75480


    晶圆尺寸:

    未知


    年份:

    2021


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    文件
    类似上架物品
    查看全部
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers年份: 2021状况: 二手上次验证:60 多天前
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers年份: 2022状况: 二手上次验证:60 多天前