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6" Fab For Sale from Moov - Click Here to Learn More
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TRESKY 3002/3102
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
    文件

    无文件

    TRESKY

    3002/3102

    verified-listing-icon

    已验证

    类别
    Die Bonders / Sorters / Attachers

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    66695


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers
    年份: 0状况: 二手
    上次验证60 多天前

    TRESKY

    3002/3102

    verified-listing-icon
    已验证
    类别
    Die Bonders / Sorters / Attachers
    上次验证: 60 多天前
    listing-photo-6b2964e8cefd49ccb07b5a27bea8b71a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1903/6b2964e8cefd49ccb07b5a27bea8b71a/0fb3397edf754adbb42752b46eda41ea_8_mw.jpeg
    listing-photo-6b2964e8cefd49ccb07b5a27bea8b71a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1903/6b2964e8cefd49ccb07b5a27bea8b71a/a7d4639c737c4d1897400fd0e070bd62_7_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    66695


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
    文件

    无文件

    类似上架物品
    查看全部
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers年份: 0状况: 二手上次验证:60 多天前
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers年份: 0状况: 二手上次验证:60 多天前
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers年份: 0状况: 二手上次验证:60 多天前