说明
Condition: Complete / No known issues Status: Deinstalled配置
BESI / ESEC 2008 xP Type D160 Heatable indexer - 3 heating zones (individually adjustable) 8’’ Cassette Handler 8’’ Wafer table Dispense unit Substrate, Dispense and Postbond Inspection. Magazine output Windows UpdateOEM 型号描述
Die Bonder文件
无文件
BESI / ESEC
2008 xP
已验证
类别
Die Bonders
上次验证： 21 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
105323
晶圆尺寸：
未知
年份：
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2008 xP
类别
Die Bonders
上次验证： 21 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
105323
晶圆尺寸：
未知
年份：
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Condition: Complete / No known issues Status: Deinstalled配置
BESI / ESEC 2008 xP Type D160 Heatable indexer - 3 heating zones (individually adjustable) 8’’ Cassette Handler 8’’ Wafer table Dispense unit Substrate, Dispense and Postbond Inspection. Magazine output Windows UpdateOEM 型号描述
Die Bonder文件
无文件