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说明
无说明配置
Installed wafermap and barcode reader, can recognize XML.AWW and other wafermap format Bonding CapabilityOEM 型号描述
Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.文件
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BESI / ESEC
2100 DS
已验证
类别
Die Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
30490
晶圆尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部BESI / ESEC
2100 DS
类别
Die Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
30490
晶圆尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Installed wafermap and barcode reader, can recognize XML.AWW and other wafermap format Bonding CapabilityOEM 型号描述
Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.文件
无文件