IS868LA2
类别
Bonders概述
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate
活动的上架物品
5
服务
检验、保险、评估、物流
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate
5
检验、保险、评估、物流