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说明
无说明配置
无配置OEM 型号描述
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate文件
无文件
ASM
IS868LA2
已验证
类别
Die Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
76359
晶圆尺寸:
未知
年份:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部ASM
IS868LA2
类别
Die Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
76359
晶圆尺寸:
未知
年份:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate文件
无文件