说明
Plasma DRIE Etch Equipment, Deep Silicon Etch, EndPoint, Mag 7配置
Tool Configuration: - Brooks Platform - Dual Loadlocks - Magnatron 7 - Alcatel ACT 600M TMP Turbo - User Interface PC - Transfer PC Process Chamber: AMS X200 - Alcatel ACT 1300M TMP Turbo Process Gases: - SF6 1000sccm - C4F8 400sccm - O2 100sccm - O2 800sccm - Ar 200sccm - N2 1000sccm - Ar - CHF3 EDM - CS200-11729 - 200/208VAC, 3 Phase, 50/60Hz Alcatel AMS X200 - CE Marked - Qty 2 - SEMCO HV52000C - SEREN L301 RF - Advanced Energy Dressler Cesar RF - ENI Spectrum B-3013 RF - 208VAC, 3 Phase, 50/60HzOEM 型号描述
未提供文件
无文件
PFEIFFER / ALCATEL / ADIXEN
AMS 4200
已验证
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
31911
晶圆尺寸：
未知
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PFEIFFER / ALCATEL / ADIXEN
AMS 4200
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
31911
晶圆尺寸：
未知
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Plasma DRIE Etch Equipment, Deep Silicon Etch, EndPoint, Mag 7配置
Tool Configuration: - Brooks Platform - Dual Loadlocks - Magnatron 7 - Alcatel ACT 600M TMP Turbo - User Interface PC - Transfer PC Process Chamber: AMS X200 - Alcatel ACT 1300M TMP Turbo Process Gases: - SF6 1000sccm - C4F8 400sccm - O2 100sccm - O2 800sccm - Ar 200sccm - N2 1000sccm - Ar - CHF3 EDM - CS200-11729 - 200/208VAC, 3 Phase, 50/60Hz Alcatel AMS X200 - CE Marked - Qty 2 - SEMCO HV52000C - SEREN L301 RF - Advanced Energy Dressler Cesar RF - ENI Spectrum B-3013 RF - 208VAC, 3 Phase, 50/60HzOEM 型号描述
未提供文件
无文件