
说明
• MxP etch chamber • Uni-body wall • Uni-lid 0020-31831 • Extended cathode ESC process kit • 1 torr process manometer • Heated pumpstack with VAT gate valve HRTV throttle • 0040-31911 ESC cathode • RF match 0010-12090 • Edward turbo (requires overhaul) • Magnet driver • Turbo controller and cable • Slit actuator and door配置
无配置OEM 型号描述
This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.文件
无文件
类别
Dry / Plasma Etch
上次验证: 18 天前
物品主要详细信息
状况:
Parts Tool
运行状况:
未知
产品编号:
139659
晶圆尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部APPLIED MATERIALS (AMAT)
CENTURA MxP
类别
Dry / Plasma Etch
上次验证: 18 天前
物品主要详细信息
状况:
Parts Tool
运行状况:
未知
产品编号:
139659
晶圆尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
• MxP etch chamber • Uni-body wall • Uni-lid 0020-31831 • Extended cathode ESC process kit • 1 torr process manometer • Heated pumpstack with VAT gate valve HRTV throttle • 0040-31911 ESC cathode • RF match 0010-12090 • Edward turbo (requires overhaul) • Magnet driver • Turbo controller and cable • Slit actuator and door配置
无配置OEM 型号描述
This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.文件
无文件