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说明
无说明配置
Mesa Twin 3chOEM 型号描述
Applied Centris AdvantEdge Mesa Etch, the smartest, fastest silicon etch system made for the volume production of the world’s most advanced memory and logic chips. Featuring an unprecedented eight process chambers – six etch and two plasma clean chambers – the compact Centris system can process up to 180 wafers per hour, lowering the per-wafer cost by up to 30%. Proprietary system intelligence software assures every process on every chamber precisely matches, delivering angstrom-level uniformity on every wafer – a critical requirement for high yield in tomorrow’s highly-complex chip designs.文件
无文件
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
117096
晶圆尺寸：
12"/300mm
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTRIS ADVANTEDGE MESA ETCH
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
117096
晶圆尺寸：
12"/300mm
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Mesa Twin 3chOEM 型号描述
Applied Centris AdvantEdge Mesa Etch, the smartest, fastest silicon etch system made for the volume production of the world’s most advanced memory and logic chips. Featuring an unprecedented eight process chambers – six etch and two plasma clean chambers – the compact Centris system can process up to 180 wafers per hour, lowering the per-wafer cost by up to 30%. Proprietary system intelligence software assures every process on every chamber precisely matches, delivering angstrom-level uniformity on every wafer – a critical requirement for high yield in tomorrow’s highly-complex chip designs.文件
无文件