CENTURA Silvia Etch
概述
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.
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APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
Dry / Plasma Etch年份: 2010状况: 二手上次验证21 天前APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
Dry / Plasma Etch年份: 2010状况: 二手上次验证30 多天前APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
Dry / Plasma Etch年份: 状况: 二手上次验证60 多天前APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
Dry / Plasma Etch年份: 2010状况: 二手上次验证60 多天前