说明
ETCH配置
3C/HOEM 型号描述
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.文件
无文件
APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
已验证
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75693
晶圆尺寸：
12"/300mm
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75693
晶圆尺寸：
12"/300mm
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ETCH配置
3C/HOEM 型号描述
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.文件
无文件