跳至主要内容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多

Moov logo

Moov Icon
LAM RESEARCH CORPORATION 2300 EXELAN FLEX
  • LAM RESEARCH CORPORATION 2300 EXELAN FLEX
  • LAM RESEARCH CORPORATION 2300 EXELAN FLEX
  • LAM RESEARCH CORPORATION 2300 EXELAN FLEX
说明
HDD included
配置
4CH
OEM 型号描述
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
文件

无文件

类别
Dry / Plasma Etch

上次验证: 30 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

127126


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部

LAM RESEARCH CORPORATION

2300 EXELAN FLEX

verified-listing-icon
已验证
类别
Dry / Plasma Etch
上次验证: 30 多天前
listing-photo-680cf64b14d946b7a09180de43a7f08b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

127126


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
HDD included
配置
4CH
OEM 型号描述
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
文件

无文件

类似上架物品
查看全部