说明
无说明配置
无配置OEM 型号描述
The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.文件
无文件
LAM RESEARCH CORPORATION
RAINBOW 4500
已验证
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
91301
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
RAINBOW 4500
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
91301
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.文件
无文件