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说明
无说明配置
Wafer EtchingOEM 型号描述
2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.文件
无文件
类别
Dry / Plasma Etch
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
129944
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
2300 SYNDION-C
类别
Dry / Plasma Etch
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
129944
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Wafer EtchingOEM 型号描述
2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.文件
无文件