说明
ETCH配置
ETCHOEM 型号描述
The Rainbow® 4520i system is a single wafer, vacuum load-locked low pressure oxide system with two active processing chambers. It is designed for integrated isotropic/anisotropic profile on high aspect ratio contact and via structures. The Isotropic Module adds isotropic oxide etching capabilities to the existing anisotropic capabilities of the Rainbow 4520, providing excellent aluminum step coverage. The Isotropic Module is incorporated onto the entrance load-lock on the Rainbow 4520, requiring only one additional wafer handling step. Having two chambers on a single machine greatly reduces the possibility of cross contamination between processes, which minimizes wafer breakage and defect densities. The system has a high uptime of ≥ 85% and is capable of isotropic etching for dielectric (oxide) films. The Rainbow® 4520i system has several applications, including contact etch, planarization, via etch, trench mask etch, and pad etch.文件
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LAM RESEARCH CORPORATION
RAINBOW 4520i
已验证
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
83880
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
RAINBOW 4520i
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
83880
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ETCH配置
ETCHOEM 型号描述
The Rainbow® 4520i system is a single wafer, vacuum load-locked low pressure oxide system with two active processing chambers. It is designed for integrated isotropic/anisotropic profile on high aspect ratio contact and via structures. The Isotropic Module adds isotropic oxide etching capabilities to the existing anisotropic capabilities of the Rainbow 4520, providing excellent aluminum step coverage. The Isotropic Module is incorporated onto the entrance load-lock on the Rainbow 4520, requiring only one additional wafer handling step. Having two chambers on a single machine greatly reduces the possibility of cross contamination between processes, which minimizes wafer breakage and defect densities. The system has a high uptime of ≥ 85% and is capable of isotropic etching for dielectric (oxide) films. The Rainbow® 4520i system has several applications, including contact etch, planarization, via etch, trench mask etch, and pad etch.文件
无文件