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说明
无说明配置
无配置OEM 型号描述
The 4520XLE system has a wide process flexibility that allows fabs to develop processes for multiple dual damascene structures and investigate how well each can integrate into the interconnect process. Its broad process window provides this flexibility through independently controlled power settings that regulate charged particle flux and energy along with a wide operating pressure range. The system is able to run high pressure processes in situ, such as photoresist strip and nitride finish etch, eliminating extra wafer handling steps. This in situ process capability lowers overall costs per wafer.文件
无文件
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
98804
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
RAINBOW 4520XLe
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
98804
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The 4520XLE system has a wide process flexibility that allows fabs to develop processes for multiple dual damascene structures and investigate how well each can integrate into the interconnect process. Its broad process window provides this flexibility through independently controlled power settings that regulate charged particle flux and energy along with a wide operating pressure range. The system is able to run high pressure processes in situ, such as photoresist strip and nitride finish etch, eliminating extra wafer handling steps. This in situ process capability lowers overall costs per wafer.文件
无文件