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LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
说明
无说明
配置
无配置
OEM 型号描述
The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.
文件

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PREFERRED
 
SELLER
类别
Dry / Plasma Etch

上次验证: 9 天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

125864


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
 
SELLER

LAM RESEARCH CORPORATION

TCP 9600SE

verified-listing-icon
已验证
类别
Dry / Plasma Etch
上次验证: 9 天前
listing-photo-266b6e6c857b49e0ac28a20a678cf013-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

125864


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
无配置
OEM 型号描述
The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.
文件

无文件

类似上架物品
查看全部