说明
无说明配置
无配置OEM 型号描述
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.文件
无文件
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124340
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
2300 EXELAN
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124340
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.文件
无文件