说明
ETCH配置
4C/HOEM 型号描述
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.文件
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LAM RESEARCH CORPORATION
2300 EXELAN
已验证
类别
Dry / Plasma Etch
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
112406
晶圆尺寸：
12"/300mm
年份：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
2300 EXELAN
类别
Dry / Plasma Etch
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
112406
晶圆尺寸：
12"/300mm
年份：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ETCH配置
4C/HOEM 型号描述
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.文件
无文件