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LAM RESEARCH CORPORATION RAINBOW 4400
    说明
    Rainbow 4428
    配置
    无配置
    OEM 型号描述
    Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.
    文件

    无文件

    类别
    Dry / Plasma Etch

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    105886


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    LAM RESEARCH CORPORATION

    RAINBOW 4400

    verified-listing-icon
    已验证
    类别
    Dry / Plasma Etch
    上次验证: 60 多天前
    listing-photo-665163dbe4104823b6ba5a837639ad74-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    105886


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Rainbow 4428
    配置
    无配置
    OEM 型号描述
    Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.
    文件

    无文件