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LAM RESEARCH CORPORATION RAINBOW 4400
  • LAM RESEARCH CORPORATION RAINBOW 4400
  • LAM RESEARCH CORPORATION RAINBOW 4400
  • LAM RESEARCH CORPORATION RAINBOW 4400
说明
Rainbow 4428
配置
无配置
OEM 型号描述
Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.
文件

无文件

类别
Dry / Plasma Etch

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

105886


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH CORPORATION

RAINBOW 4400

verified-listing-icon
已验证
类别
Dry / Plasma Etch
上次验证: 60 多天前
listing-photo-665163dbe4104823b6ba5a837639ad74-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

105886


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Rainbow 4428
配置
无配置
OEM 型号描述
Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.
文件

无文件