说明
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production lines配置
无配置OEM 型号描述
未提供文件
无文件
SAMCO
200C
类别
Dry / Plasma Etch
上次验证： 7 天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
138665
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production lines配置
无配置OEM 型号描述
未提供文件
无文件