说明
Physical Specifications Main Unit: 44"W x 42"D x 26"H (112cm x 107cm x 66cm) Weight: 500lb (227kg) NOT INCLUDE VACUUM PUMP AND CHILLERS.配置
Wafer Sizes (Customized) Handles 3”(75mm), 4”(100mm), 5”(125mm), 6”(150mm) Silicon. Proven reactor chamber assembly with upper and lower electrode. Original belt system for Super Spatulas and Shuttle wafer transfer Substrate Positioning Processing directly on cooled wafer chuck. RF Matching Network 13.56 MHz fully automated. Solid State RF Generator ENI ACG-10B 13.56MHz. RF power: 50 to 1000 watts Typical Temperature controller with Julabo chiller 0-80°C. Original AC/DC power supply Tegal box. Gas Control, 4 independent gas line with 4 MFCs (Customized). Pressure Pressure Control Accurate, closed-loop pressure control with UPC and MKS Baratron capacitance pressure manometer. Process pressure 0 - 5000 mTorr. Front and rears touch screen monitor Tegal 90X Integrated Flat Panel Display • On-Screen 9XX System Schematics • Repair & Maintenance Data Files Included. Real-Time graphics Endpoint display. System functions Real-Time process data acquisition on display. Optical Endpoint Parameters. Absolute endpoint time system. Timed cycles up to 4 hour each Wafer quartz pins up/down Calibration and Built-in diagnostic functions. Recipe creation for fully automatic wafer processing. SEC/GEM communication function Rev. II Multi level password protections. Storage of 20 recipes Configuration system, Process Data and Recipe storage on a EEprom. Physical Specifications Main Unit: 44"W x 42"D x 26"H (112cm x 107cm x 66cm) Weight: 500lb (227kg) NOT INCLUDE VACUUM PUMP AND CHILLERS. Facility RequirementsOEM 型号描述
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TEGAL
903
类别
Dry / Plasma Etch
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
140566
晶圆尺寸：
3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Physical Specifications Main Unit: 44"W x 42"D x 26"H (112cm x 107cm x 66cm) Weight: 500lb (227kg) NOT INCLUDE VACUUM PUMP AND CHILLERS.配置
Wafer Sizes (Customized) Handles 3”(75mm), 4”(100mm), 5”(125mm), 6”(150mm) Silicon. Proven reactor chamber assembly with upper and lower electrode. Original belt system for Super Spatulas and Shuttle wafer transfer Substrate Positioning Processing directly on cooled wafer chuck. RF Matching Network 13.56 MHz fully automated. Solid State RF Generator ENI ACG-10B 13.56MHz. RF power: 50 to 1000 watts Typical Temperature controller with Julabo chiller 0-80°C. Original AC/DC power supply Tegal box. Gas Control, 4 independent gas line with 4 MFCs (Customized). Pressure Pressure Control Accurate, closed-loop pressure control with UPC and MKS Baratron capacitance pressure manometer. Process pressure 0 - 5000 mTorr. Front and rears touch screen monitor Tegal 90X Integrated Flat Panel Display • On-Screen 9XX System Schematics • Repair & Maintenance Data Files Included. Real-Time graphics Endpoint display. System functions Real-Time process data acquisition on display. Optical Endpoint Parameters. Absolute endpoint time system. Timed cycles up to 4 hour each Wafer quartz pins up/down Calibration and Built-in diagnostic functions. Recipe creation for fully automatic wafer processing. SEC/GEM communication function Rev. II Multi level password protections. Storage of 20 recipes Configuration system, Process Data and Recipe storage on a EEprom. Physical Specifications Main Unit: 44"W x 42"D x 26"H (112cm x 107cm x 66cm) Weight: 500lb (227kg) NOT INCLUDE VACUUM PUMP AND CHILLERS. Facility RequirementsOEM 型号描述
未提供文件
无文件