
说明
Dry etch system配置
Known issues: Not included: Pirani Gauge; (Qty 2) Capacitance Manometer; (Qty 2) PS1 Solenoid Bank; (Qty 2) Bolts for LLM Lid; Robot PS1 Center Stage; Chiller; (Qty 4) Fiber Optics; (Qty 4) Linear Rail Bearings LM Robot Handler (Qty 3) FOUP Factory Interface (Qty 2) LLM Arm Process: HF NH3 Gas Etch CIM: IFAOEM 型号描述
Certas WING™ is the 2nd generation plasma-free gas chemical etch system from Tokyo Electron targeted at selective oxide film etching. Productivity of the new tool has been improved with twice the throughput while maintaining the same footprint. The Certas WING™ process capability has been expanded to achieve higher etch volumes and provide flexibility for etching of a wider variety of silicon based films that will be used in future semiconductor device manufacturing.文件
无文件
类别
Dry / Plasma Etch
上次验证: 6 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
154814
晶圆尺寸:
12"/300mm
年份:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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Certas WING
类别
Dry / Plasma Etch
上次验证: 6 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
154814
晶圆尺寸:
12"/300mm
年份:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Dry etch system配置
Known issues: Not included: Pirani Gauge; (Qty 2) Capacitance Manometer; (Qty 2) PS1 Solenoid Bank; (Qty 2) Bolts for LLM Lid; Robot PS1 Center Stage; Chiller; (Qty 4) Fiber Optics; (Qty 4) Linear Rail Bearings LM Robot Handler (Qty 3) FOUP Factory Interface (Qty 2) LLM Arm Process: HF NH3 Gas Etch CIM: IFAOEM 型号描述
Certas WING™ is the 2nd generation plasma-free gas chemical etch system from Tokyo Electron targeted at selective oxide film etching. Productivity of the new tool has been improved with twice the throughput while maintaining the same footprint. The Certas WING™ process capability has been expanded to achieve higher etch volumes and provide flexibility for etching of a wider variety of silicon based films that will be used in future semiconductor device manufacturing.文件
无文件