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TEL / TOKYO ELECTRON UltraTrimmer 30
    说明
    TEL EPION INC., ULTRATRIMMER 30 Etching System
    配置
    无配置
    OEM 型号描述
    Gas Cluster Ion Beam system TEL’s UltraTrimmer series provides precise control of film thickness by reducing surface roughness. Cutting edge technology enables industry leading performance: sub-nanometer thickness control, a wide range of dynamic correction and high-throughput processing. UltraTrimmer series realizes a variety of custom process profiles for silicon or compound substrate and contributes to yield improvement and performance enhancement.
    文件

    无文件

    类别
    Dry / Plasma Etch

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    116019


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    TEL / TOKYO ELECTRON

    UltraTrimmer 30

    verified-listing-icon
    已验证
    类别
    Dry / Plasma Etch
    上次验证: 60 多天前
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    listing-photo-94d20a479bd74d228d54bb1b70db6b66-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/29044/94d20a479bd74d228d54bb1b70db6b66/487459b8830e4fe8a1ccb551ec6e455b_7b200b12e3854847942e2cf304dc586a1201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    116019


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    TEL EPION INC., ULTRATRIMMER 30 Etching System
    配置
    无配置
    OEM 型号描述
    Gas Cluster Ion Beam system TEL’s UltraTrimmer series provides precise control of film thickness by reducing surface roughness. Cutting edge technology enables industry leading performance: sub-nanometer thickness control, a wide range of dynamic correction and high-throughput processing. UltraTrimmer series realizes a variety of custom process profiles for silicon or compound substrate and contributes to yield improvement and performance enhancement.
    文件

    无文件