说明
Unity-CVD TiN System配置
无配置OEM 型号描述
The UNITY® Etch System by TEL is a 200mm etching system that has set the industry benchmark for reliability worldwide. The system has undergone several improvements, with the development of the UNITY® II, UNITY® IIe, and most recently the UNITY® M(e). The UNITY® provides a reliable platform for various chambers, utilizing two plasma sources: the DRM (Dipole Ring Magnet), a MERIE source, and the SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the newest chamber, SCCM, provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, offering optimal productivity and reliability based on ongoing refinements to a proven platform.文件
无文件
TEL / TOKYO ELECTRON
UNITY
已验证
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
109556
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
UNITY
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
109556
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Unity-CVD TiN System配置
无配置OEM 型号描述
The UNITY® Etch System by TEL is a 200mm etching system that has set the industry benchmark for reliability worldwide. The system has undergone several improvements, with the development of the UNITY® II, UNITY® IIe, and most recently the UNITY® M(e). The UNITY® provides a reliable platform for various chambers, utilizing two plasma sources: the DRM (Dipole Ring Magnet), a MERIE source, and the SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the newest chamber, SCCM, provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, offering optimal productivity and reliability based on ongoing refinements to a proven platform.文件
无文件