说明
RIE Single Wafer Plasma Metal Etcher 8” (dia.) Chuck RFX-600 RF Generator, 13.56 MHz Automatic RF Matching Network Vacuum Loadlock 4ea Mass Flow Controllers 100 sccm O2 100 sccm CF4 50 sccm Cl2 100 sccm BCl3 PC Process Controller Color Touch Screen Graphical User Interface配置
无配置OEM 型号描述
The Minilock system incorporates a vacuum load-lock in a compact table top console. The system has been designed to meet all the safety and equipment needs for the more challenging processes in the laboratory environment. Its modular design and optional gas cabinet provide the user with a turnkey system that meets your safety, facility and processing needs. The Minilock is suitable for anisotropic etching of aluminum, silicides, gallium arsenide and other materials requiring chlorinated chemistries. It is also suitable for anisotropic etching of silicon dioxide, silicon nitride and other materials requiring high selectivity and a controlled anisotropic etch. The system specifications are 35"Wx26"Dx48"H with RF Power of 600 watt, 13.56 MHz and up to 6 Mass Flow Controllers. The maximum wafer size is up to 8".文件
无文件
TRION
MINILOCK
已验证
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
12010
晶圆尺寸：
8"/200mm
年份：
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TRION
MINILOCK
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
12010
晶圆尺寸：
8"/200mm
年份：
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
RIE Single Wafer Plasma Metal Etcher 8” (dia.) Chuck RFX-600 RF Generator, 13.56 MHz Automatic RF Matching Network Vacuum Loadlock 4ea Mass Flow Controllers 100 sccm O2 100 sccm CF4 50 sccm Cl2 100 sccm BCl3 PC Process Controller Color Touch Screen Graphical User Interface配置
无配置OEM 型号描述
The Minilock system incorporates a vacuum load-lock in a compact table top console. The system has been designed to meet all the safety and equipment needs for the more challenging processes in the laboratory environment. Its modular design and optional gas cabinet provide the user with a turnkey system that meets your safety, facility and processing needs. The Minilock is suitable for anisotropic etching of aluminum, silicides, gallium arsenide and other materials requiring chlorinated chemistries. It is also suitable for anisotropic etching of silicon dioxide, silicon nitride and other materials requiring high selectivity and a controlled anisotropic etch. The system specifications are 35"Wx26"Dx48"H with RF Power of 600 watt, 13.56 MHz and up to 6 Mass Flow Controllers. The maximum wafer size is up to 8".文件
无文件