说明
无说明配置
无配置OEM 型号描述
The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.文件
无文件
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER S ECD
已验证
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
40625
晶圆尺寸：
未知
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER S ECD
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
40625
晶圆尺寸：
未知
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.文件
无文件