说明
无说明配置
Raider214, UI included. 8 inch, 3 x Casseette. 1 X Linear Dual Arm Robot with Edge Grip endeffector, 3 X Acid Spray & SRD, 10 X ECD CFD3 Raptor , 1 x Aligner, 1 x WIP Computer, 1 X Module Computer, 1 X Robot Computer, 1 X UI ComputerOEM 型号描述
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.文件
无文件
类别
Electro Plating
上次验证： 今天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
138239
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
类别
Electro Plating
上次验证： 今天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
138239
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Raider214, UI included. 8 inch, 3 x Casseette. 1 X Linear Dual Arm Robot with Edge Grip endeffector, 3 X Acid Spray & SRD, 10 X ECD CFD3 Raptor , 1 x Aligner, 1 x WIP Computer, 1 X Module Computer, 1 X Robot Computer, 1 X UI ComputerOEM 型号描述
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.文件
无文件