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说明
No HDD配置
System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEM 型号描述
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文件
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106008
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE 3D
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106008
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available